[News]AVS Series Packaging: Streamlined and Ready for Launch

Until now, we have only introduced the board and camera modules, but due to requests for cases, we are preparing designs as shown below.

Adjustments to the number and placement of I/O ports may be necessary, but we are proceeding with a design that features aluminum cases for heat dissipation and external fans for cooling. We aim for effective application in a wide range of environments.

Below are the case size and drawings for the AVS100.


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